PCB Fab
Etching
Exposure Machine
Drilling Machine-Schmoll
PTH Line
Solderability Preservative
Automatic Lamination
Roll To Roll
Inner Brown Oxide Line
CNC Routing Machine
Laser Direct Imaging
Immersion Line
Pre-Treatment
PCB Assembly
Automatic Loader
Screen Printer
High Speed Chips Mounter
Multifunction IC Mounter
Reflow
Automatic Unloader
BGA Rework Machine
Electron Microscope
Bake Oven
Oven Temperature Tester
Components
Resistance
Capacitance
Inductance
MOS
MCU/ICS
DC/DC
Relays
Module
Others
PCB Design
Parts Sourcing
Mouser
PWG
CEC Port
Digi-Key
Avnet
RS Compenents
Arrow
Element14
AOI
AOI Inspection
X-Ray
X-Ray
Wave Soldering
Wave Soldering
ICT
ICT
Anti-Corrosion Paint
Anti-Corrosion Paint
Fixture Custom
Fixture Custom
LCD Screen Custormization
LCD Screen Custormization
Others
Stainless Steel Machining
Carbon Fibre
Multifunction IC Mounter

In order to meet the customer's production prototype, we purchased one of the SMT equipment, can complete all the SMD components are assembled, a real device mount, even the prototype of customers, the equipment utilization rate is still relatively high.

Supports production for large panels and simultaneous production of two models

The AIMEX III can support large panels up to 774 (L) x 710 (W) mm in size.
Simultaneous production of two different products is possible using a double conveyor configuration machine. The AIMEX III also enables various production methods and supports a wide range of panel sizes.

 

 

Supporting 0402 (01005") to 74 x 74 mm by one head

A DX head exchanges the dedicated tool in one action depending on the part size, from small chips to large odd-form parts. Also, using wide range nozzles together provides further efficient placement.

 

 

PCB size(L x W):

48 x 48 mm to 774 x 610 mm (double conveyor)*
48 x 48 mm to 774 x 710 mm (single conveyor)
*Double conveyors can handle PCBs up to 330 (W) mm. PCBs larger than 330 (W) mm must be produced by changing the double conveyor to single lane production mode.

 

Feeder capacity : Up to 130 (8 mm tape)

 

Placing accuracy:

H24G: +/-0.025 mm (Standard mode) / +/-0.038 mm (Productivity priority mode, under development) (3sigma) cpk≥1.00
H08M: +/-0.040 mm (3σ) cpk≥1.00
OF: +/-0.050 mm (3σ) cpk≥1.00
H02F: +/-0.025 mm (3σ) cpk≥1.00
H01: +/-0.030 mm (3σ) cpk≥1.00