
- PCB Fab
- Etching
- Exposure Machine
- Drilling Machine-Schmoll
- PTH Line
- Solderability Preservative
- Automatic Lamination
- Roll To Roll
- Inner Brown Oxide Line
- CNC Routing Machine
- Laser Direct Imaging
- Immersion Line
- Pre-Treatment
- PCB Assembly
- Automatic Loader
- Screen Printer
- High Speed Chips Mounter
- Multifunction IC Mounter
- Reflow
- Automatic Unloader
- BGA Rework Machine
- Electron Microscope
- Bake Oven
- Oven Temperature Tester
- Components
- Resistance
- Capacitance
- Inductance
- MOS
- MCU/ICS
- DC/DC
- Relays
- Module
- Others
- PCB Design
- AOI
- AOI Inspection
- X-Ray
- X-Ray
- Wave Soldering
- Wave Soldering
- ICT
- ICT
- Anti-Corrosion Paint
- Anti-Corrosion Paint
- Fixture Custom
- Fixture Custom
- LCD Screen Custormization
- LCD Screen Custormization
HORIZONTAL IMMERSION
SILVER PROCESS
Silver thickness reaches 0.1 μm ~ 0.5 μm, no oxidation
WORKING PRINCIPLE
Deposit a silver layer on areas where part soldering or assembly to enhance the solderability. PROCESS Inlet → Cleaning → Rinsing → Micro-Etching → Rinsing → Pre-Immersion → Electroless Silver → Hot Water Rinsing → Rinsing → Post Cleaning → Rinsing → Hot Water Rinsing → Drying → Output
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Immersion Silver | Drilled Flood Bar |
TECHNICAL SPECIFICATION
• Panel size: max. 610 × 610 mm / min. 250 × 250 mm
• Panel thickness: 0.1 mm ~ 3.2 mm
• Hole diameter: PTH Hole diameter: min 0.1 mm A/r 10:1 BVH Hole diameter: min 0.075 mm A /r 1:1
FEATURES
Efficient cleaning ability, to prevent ion contamination
• No roller mark, water mark and scratch
• No dirt or residual chemicals after wet cleaning
• High conveying stability with deviation at ±10 mm
• Process procedures matching to the solutions and demands of customers
• Equipped with automatic control systems to ensure process parameter stability
• Over 95 % modularized products to maximize part sharing
• Excellent squeeze roller design with drag out ≤10 cc/m2 to prevent chemistry drag out and contamination
• Slope bottom tank design for the chemical process to minimize solution leftover and wastewater treatment load after rinsing
• Condenser to reduce solution loss by 50 % and exhaust loading
• Slope-bottom and small-volume tank design for the rinsing to increase the refresh rate
• Maximum uptime ≥ 95 %
• Easy to operate and maintain with visualized management PLC + HMI
• Comply with environment-friendly policy
HORIZONTAL IMMERSION
TIN PROCESS
Enhance cleaning ability to prevent ion contamination
WORKING PRINCIPLE
Deposit a tin layer on areas where part soldering or assembly to enhance the solderability.
PROCESS
Inlet → Acid Rinsing → Rinsing → Micro-Etching → Rinsing → Pre-Immersion → Immersion → Post-Immersion → Effluent Rinsing → Rinsing → RAD / NPT Tanks → Rinsing → Hot Ultrasonic Rinsing → Rinsing → RPT/NPT Tanks → Rinsing → Drying → Output
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Preassemble Piping | Indirect Heating |
TECHNICAL SPECIFICATION
• Panel size: max. 610 × 610 mm / min. 250 × 250 mm
• Panel thickness: 0.1 mm ~ 3.2 mm
• Hole diameter: PTH Hole diameter: min 0.1 mm A/r 10:1 BVH Hole diameter: min 0.075 mm A /r 1:1
PRODUCT FEATURES
No whisker process from our chemical coordinator, completely eliminate the whisker risk
• No roller mark, water mark and scratch
• No dirt or residual chemicals after wet cleaning
• No whisker process from our chemical coordinator, completely eliminate the whisker risk
• High conveying stability with deviation at ± 10 mm
• Process procedures matching to the solutions and demands of customers
• Equipped with automatic control systems to ensure the longest uptime
• Over 95 % modularized products to maximize parts sharing
• Excellent squeeze roller design with drag out ≤10 cc/m2 to prevent chemistry drag out and contamination
• Slope bottom tank design for the chemical process to minimize solution leftover and wastewater treatment load after rinsing
• Condenser to reduce solution loss by 50 % and exhaust loading
• Slope-bottom and small-volume tank design for the rinsing process to increase the tank replacement rate by 50 %
• Maximum uptime ≥ 95 %
• Easy to operate and maintain with visualized management PLC + HMI
• Comply with environment-friendly policy