PCB Fab
Etching
Exposure Machine
Drilling Machine-Schmoll
PTH Line
Solderability Preservative
Automatic Lamination
Roll To Roll
Inner Brown Oxide Line
CNC Routing Machine
Laser Direct Imaging
Immersion Line
Pre-Treatment
PCB Assembly
Automatic Loader
Screen Printer
High Speed Chips Mounter
Multifunction IC Mounter
Reflow
Automatic Unloader
BGA Rework Machine
Electron Microscope
Bake Oven
Oven Temperature Tester
Components
Resistance
Capacitance
Inductance
MOS
MCU/ICS
DC/DC
Relays
Module
Others
PCB Design
Parts Sourcing
Mouser
PWG
CEC Port
Digi-Key
Avnet
RS Compenents
Arrow
Element14
AOI
AOI Inspection
X-Ray
X-Ray
Wave Soldering
Wave Soldering
ICT
ICT
Anti-Corrosion Paint
Anti-Corrosion Paint
Fixture Custom
Fixture Custom
LCD Screen Custormization
LCD Screen Custormization
Others
Stainless Steel Machining
Carbon Fibre
Pre-Treatment

Our PCB production solutions apply for PCB wet production process, the product portfolio including the process tools of pre-treatment, development-etching-stripping, oxide replacement, DSM & PTH, development, immersion silver, immersion tin, OSP and automation systems.
They are characterized by
• Low water and chemical consumption reduce running cost and minimize impact on the environment.
• Customized design to meet process demands.
The aim is to achieve highly reliable production processes on the customer side while steadily improving performance parameters for products manufactured.
• Fine line has integrated with direct image systems and high resolution DES sys- tems. The new solution helps to create the fine line pattern to maximum a utility of PCB layout within a limited space.

PRE-TREATMENT
PROCESS

 

Solder Mask Pre-Clean(Ultra-Roughness) Direct Spray. No Shadow


                                  
TECHNICAL SPECIFICATION
• Panel size: max. 610 × 610mm / min. 250 × 250mm
• Panel thickness: 0.05 mm (core) +Cu ~3.2 mm of Traditional PCB 0.8 mm ~ 12 mm of back panel
• Hole diameter: PTH min 0.1 mm A /r 10:1 BVH min 0.075 mm A /r 1:1

FEATURES
Excellent cleaning ability without chemical residuals to prevent oxidation
• No roller mark, water mark and scratch
• Micro-etching depth 1.0 μm~ 1.5 μm
• Water break test for at least 30 seconds ( with pure water cleaning )
• No oxidization after standing in the clean room for 4 hours
• No dirt or residual chemicals after wet cleaning
• Accurate transporting systems with deviation at ±10mm
• Compatible with the chemical requirement and needs of customers
• Equipped with automatic control systems to ensure longest uptime
• Over 95 % modularized products to maximize parts sharing
• Excellent squeeze roller design with drag out ≤10cc/m2 to prevent chemistr drag out and contamination
• Slope bottom tank design for the chemical process to minimize solution leftover and wastewater treatment load after rinsing
• Slope-bottom and small-volume tank design for the rinsing process to increase the tank replacement rate by 50%
• Condenser to reduce solution loss by 50% and exhaust loading
• Maximum uptime ≥ 95%
• Easy to operate and maintain with visualized management PLC + HMI (optional with CIM)