HORIZONTAL DSM
PTH PROCESS
Backlight ≥ level 9. Excellent uniformed electroless cooper deposition.

WORKING PRINCIPLE
Remove and texture the drilled hole wall, depositing electroless cooper for coming electroplating process. PROCESS Inlet → Swelling → Rinsing → Desmearing → Stainless Steel Descaling → Preneutralization → Rinsing → Neutralization → Rinsing → Inspection → Hole Conditioning → Rinsing → Micro-Etching → Rinsing → Pre-Immersion → Activation → Rinsing → Electroless Copper → Rinsing → Acid Immersion → Rinsing → Drying → Output

DSM	Electroless Copper Deposit

TECHNICAL SPECIFICATION
• Panel size: max. 610 × 610 mm / min. 250 × 250 mm
• Panel thickness: 0.05 mm (core) + Cu ~ 2.4 mm 0.1 mm (core) ~ 3.2 mm
• Hole size: PTH Hole: min 0.1 mm A/ R 10:1 BVH Hole: min 0.075 mm A / R 1:1

FEATURES
High regeneration rate of Mn 6+ , without generating sludge. Deposition thickness of electroless copper 0.5 μm ~1.0 μm
• No roller mark, water mark and scratch
• No dirt or residual chemicals after wet cleaning
• High conveying stability with deviation at ± 10 mm (with width control device)
• Process procedures matching to the solutions and demands of customers
• Equipped with automatic control systems to ensure the longest uptime (option -ally with automatic lift-up flood elements and frequency controlled pumps)
• Perfect computer-integrated manufacturing system
• Well-planned process machine data setup and collection
• Excellent Mn6+ activation: Mn6+ content < 25 g / L
• Excellent chemical copper deposition speed and thickness with at least Grade 9 backlight
• Great covering power of through-hole and blind hole
• Over 95 % modularized products to maximize parts sharing
• Excellent squeeze roller design with drag out ≤ 10 cc/m2 to prevent chemical drag out and contamination
• Slope bottom tank design for the chemical process to minimize solution leftover and wastewater treatment load after rinsing
• Condenser to reduce solution loss by 50 % and exhaust loading
• Slope-bottom and small-volume tank design for the rinsing process to increase the tank replacement rate by 50 %
• Maximum uptime ≥ 95 %